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STMicroelectronics STM32F767NGH6 — Microcontrollers & Processors (MCU / MPU / DSP)

STM32F767NGH6 ARM Cortex-M7 MCU, 216 MHz, 1 MB Flash

MPNSTM32F767NGH6
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STMicroelectronics STM32F7 series, STM32F767NGH6, ARM Cortex-M7 32-bit MCU, 216 MHz, 1 MB Flash, 512K x 8 SRAM, 168 I/O, 216-TFBGA, -40°C to 85°C.

$19.5500Ref. price · indicative, final on quote
Packaging216-TFBGA
RoHSROHS3 Compliant
SeriesSTM32F7
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

STM32F767NGH6 specifications
ParameterValue
SeriesSTM32F7
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.7V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed216MHz
PackageTray
RAM size512K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART/USART, USB OTG
Number of i (O)168
Core processorARM® Cortex®-M7
Case216-TFBGA
Data convertersA/D 24x12b; D/A 2x12b
Program memory size1MB (1M x 8)

Product details

216 MHz — what the core speed means for real-time control and throughput

At 216 MHz, the Cortex-M7 can sustain single-cycle multiply-accumulate operations and has a six-stage pipeline with branch prediction. For a motor-control loop running a field-oriented control algorithm at 20 kHz, this leaves enough headroom to also handle Ethernet communication and a user interface without a second MCU. The 216 MHz clock also drives the internal oscillator, so no external crystal is required for the core timing — though the internal oscillator's accuracy (±1% typical) should be checked against the application's timing budget.

1 MB Flash and 512 KB SRAM — memory sizing for firmware and data buffers

The 1 MB Flash is organized as 1M x 8 bits, which is enough for a full-featured RTOS, a TCP/IP stack, and a modest GUI library. The 512 KB SRAM (512K x 8) can hold several camera frames at VGA resolution or a large audio buffer for SPDIF output. If the application needs more RAM, the EBI/EMI interface on the connectivity list can drive external SRAM or SDRAM. The Flash is rated for 10,000 erase/write cycles per sector — adequate for field-upgradeable firmware with wear-leveling in the bootloader.

216-TFBGA — what the package demands from the PCB layout

The 168 I/O signals include multiple high-speed interfaces — Ethernet RMII, USB OTG HS, QSPI at up to 133 MHz — so signal-integrity rules for trace length matching and impedance control apply. The package is surface-mount only; no socketed prototyping. A four-layer board with a dedicated ground plane is the practical minimum for this density.

Connectivity and peripherals — Ethernet, CAN, USB, and more

The STM32F767NGH6 includes a full set of wired interfaces: Ethernet MAC (with external PHY), two CAN 2.0B controllers, USB OTG HS and FS, multiple SPI and I²C ports, and an SPDIF receiver interface for digital audio. The LCD parallel interface can drive a TFT display directly. For data storage, the MMC/SD/SDIO interface connects to external SD cards.

The STM32F7 series is a mainstream high-performance family that continues to receive firmware updates through STM32CubeMX and the HAL library. For a production BOM, this means no last-time-buy pressure and no forced redesign in the near term.

Frequently asked questions

What is the maximum clock speed of STM32F767NGH6?

The STM32F767NGH6 runs at 216 MHz from the internal oscillator or an external clock source. At this speed the Cortex-M7 core can execute single-cycle multiply-accumulate instructions, which is the key spec for real-time control loops and DSP workloads.

What are the alternatives or equivalents to STM32F767NGH6?

A lower-power alternative in the same STM32 portfolio is the STM32L151CBU6A, which uses an ARM Cortex-M3 core at 32 MHz with 37 I/O and a smaller memory footprint. The STM32F767NGH6 targets high-performance applications with its 216 MHz M7 core, 1 MB Flash, and 168 I/O — the STM32L1 series is not a pin-compatible drop-in but a power-optimized choice for battery-operated designs.