STM32F765ZIT7

STMicroelectronics · STM32F7 Series

STMicroelectronics STM32F7 series, STM32F765ZIT7, ARM Cortex-M7 32-Bit Single-Core MCU, 216 MHz, 2 MB Flash, 512K x 8 RAM, 114 I/O, 144-LQFP, -40°C to 105°C.

STMicroelectronics STM32F765ZIT7
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Technical specifications

STM32F765ZIT7 specifications
Parameter / AttributeSpecification / Value
SeriesSTM32F7
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.7V ~ 3.6V
Operating temperature-40°C ~ 105°C (TA)
Speed216MHz
PackageTray
RAM size512K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART/USART, USB OTG
Number of i (O)114
Core processorARM® Cortex®-M7
Case144-LQFP
Data convertersA/D 24x12b; D/A 2x12b
Program memory size2MB (2M x 8)

Technical details

ARM Cortex-M7 at 216 MHz — what the core speed buys you

The STM32F765ZIT7 is a 32-bit single-core MCU built around the ARM Cortex-M7 core running at 216 MHz. That clock rate puts it in the high-performance tier of the STM32F7 family, well above the 32 MHz Cortex-M3 parts like the STM32L151 series. For firmware engineers, the 216 MHz PLL needs the flash prefetch and ART accelerator enabled before pushing past 200 MHz, or instruction-fetch stalls will eat the throughput gain. The core includes a single-precision FPU and a 6-stage pipeline with branch prediction — useful for real-time control loops and sensor fusion algorithms that would bog down a Cortex-M4.

2 MB Flash and 512 KB SRAM — memory budget for complex firmware

Program memory is 2 MB of Flash, organized as 2M x 8 bits. That is enough space for a full TCP/IP stack, a graphics library driving a QVGA display, and a bootloader with OTA staging area — no external SPI Flash needed for the main image. The 512 KB SRAM (512K x 8) handles Ethernet packet buffers, audio sample arrays, and multiple protocol stacks simultaneously without thrashing. If you are porting a legacy STM32F1 or STM32F4 project, the extra RAM headroom means you can keep more state in memory rather than swapping to external storage.

Connectivity and I/O — Ethernet, CAN, USB OTG, and 114 GPIOs

Package and footprint — 144-LQFP (20x20 mm)

The 144-LQFP package measures 20x20 mm with 0.5 mm pitch. That is a standard QFP footprint — no hidden thermal pad, no BGA rework challenges.

STMicroelectronics lists the STM32F765ZIT7 as an active product with ROHS3 compliance.

STM32F765ZIT7
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