STM32F745ZGT6

STMicroelectronics · STM32F7 Series

STMicroelectronics STM32F7 series STM32F745ZGT6, ARM Cortex-M7 32-Bit Single-Core MCU, 216 MHz, 1 MB FLASH, 320K x 8 RAM, 114 I/O, 144-LQFP, -40°C to 85°C.

STMicroelectronics STM32F745ZGT6
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Technical specifications

STM32F745ZGT6 specifications
Parameter / AttributeSpecification / Value
SeriesSTM32F7
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.7V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed216MHz
PackageTray
RAM size320K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, SAI, SD, SPDIF-Rx, SPI, UART/USART, USB OTG
Number of i (O)114
Core processorARM® Cortex®-M7
Case144-LQFP
Data convertersA/D 24x12b; D/A 2x12b
Program memory size1MB (1M x 8)

Technical details

The STM32F745ZGT6 is STMicroelectronics' mid-range STM32F7 series MCU built around a single ARM Cortex-M7 core clocked at 216 MHz. The 114 I/O in a 144-LQFP package means you can route a parallel display, an external memory bus (EBI/EMI), and a dozen serial peripherals without multiplexing — useful for HMI panels or industrial gateway designs. The Cortex-M7 core includes a single-precision FPU and a DSP instruction set, so the 216 MHz clock actually translates to real throughput on FFTs or motor-control loops — not just a headline number. The flash controller needs zero wait states up to around 100 MHz; beyond that the prefetch buffer and ART Accelerator keep the pipeline fed, but if you're running tight loops from flash at full speed, budget a cycle or two of latency on the first access.

Connectivity and peripheral mix — one chip for a control-plane node

There's also an SPDIF-Rx input for digital audio and a SDIO interface for external storage. The brown-out detect and POR eliminate external supervisor ICs in many designs.

Housed in a 144-LQFP with a 20x20 mm body — a standard fine-pitch QFP that reflows on any leaded process. The 114 GPIOs are distributed around all four sides, so a four-layer board with a ground plane under the package is sufficient for most designs. The exposed pad (if present on the LQFP variant) should be stitched to ground with a grid of vias for thermal relief; the part draws a few hundred mA peak during active transmit on Ethernet or USB.

STM32F745ZGT6
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