STM32F732IEK6 — 216MHz Cortex-M7 MCU, 512KB Flash, 201-UFBGA
STMicroelectronics STM32F7 series, STM32F732IEK6; 32-bit ARM Cortex-M7 single-core at 216MHz; 512KB Flash, 256KB RAM; 140 I/O; 201-UFBGA Tray pack; 1.7–3.6V supply; -40°C to 85°C operating temperature.
- 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
- Date & lot codes on quoteStated per line before you commit; label photos on request.
- MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
- PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.
Specifications
| Parameter | Value |
|---|---|
| Series | STM32F7 |
| Mounting type | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.7V ~ 3.6V |
| Operating temperature | -40°C ~ 85°C (TA) |
| Speed | 216MHz |
| Package | Tray |
| RAM size | 256K x 8 |
| Core size | 32-Bit Single-Core |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT |
| Connectivity | CANbus, EBI/EMI, I²C, IrDA, LINbus, MMC/SD, QSPI, SAI, SPI, UART/USART, USB |
| Number of i (O) | 140 |
| Core processor | ARM® Cortex®-M7 |
| Case | 201-UFBGA |
| Data converters | A/D 24x12b; D/A 2x12b |
| Program memory size | 512KB (512K x 8) |
Frequently asked questions
The STM32F732IEK6 is in 201-UFBGA — what does that mean for SMT line setup?
The 201-UFBGA (10×10mm, 0.5mm pitch) is a fine-pitch BGA package, not a standard Gull-wing or QFN variant. Tray packing means no tape-and-reel orientation conventions. High-speed placement equipment — Fuji NXT-III or equivalent — will need a calibrated BGA nozzle and a verified pick-height reference. Panel-build orders of 40 units in Tray require incoming inspection for ball integrity and coplanarity before reflow.
STM32F732IEK6 vs STM32F730R8T6 — what is the RAM difference and does it affect the QSPI boot map?
The STM32F732IEK6 has 256KB of on-chip SRAM versus 64KB on the F730R8T6 peer. The 140-I/O on the F732 is the full multiplexed pin count for this package; it is not a gated subset — you have the full peripheral complement available. QSPI boot and external-memory XIP capability is shared at the series level, so a Flash-memory footprint validated on the F732 would port to the F730 if a memory-reduced BOM revision becomes necessary.