STM32F437IIH6

STMicroelectronics · STM32F4 Series

STMicroelectronics STM32F4 series, ARM Cortex-M4 32-bit MCU, 180 MHz, 2 MB Flash, 256K x 8 SRAM, Ethernet, CAN, USB OTG, 140 I/O, 1.8-3.6 V, -40 to 85 °C, 176+25 UFBGA (10x10 mm), Tray.

STMicroelectronics STM32F437IIH6
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Technical specifications

STM32F437IIH6 specifications
Parameter / AttributeSpecification / Value
SeriesSTM32F4
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed180MHz
PackageTray
RAM size256K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SPI, UART/USART, USB OTG
Number of i (O)140
Core processorARM® Cortex®-M4
Case201-UFBGA
Data convertersA/D 24x12b; D/A 2x12b
Program memory size2MB (2M x 8)

Technical details

180 MHz Cortex-M4 with 2 MB Flash — the compute and memory budget

The STM32F437IIH6: ARM Cortex-M4 core at 180 MHz with 2 MB Flash and 256K x 8 SRAM.

Ethernet, CAN, and USB OTG — one-chip connectivity stack

This MCU integrates Ethernet MAC, CANbus, and USB OTG alongside I2C, SPI, UART/USART, and IrDA interfaces. For a BOM-conscious design, that means a single STM32F437IIH6 can handle the control, display, and wired-communication functions that would otherwise require separate PHY or bridge chips. The 140 I/O count provides headroom for parallel sensor arrays, addressable LED strips, or parallel-memory buses via the EBI/EMI controller.

176+25 UFBGA — footprint planning for the 10x10 mm BGA

The exposed center pad (thermal ball) needs a via-stitched copper island on the top layer to pull heat into the inner planes; without it, junction temperature rises quickly above 400 mA continuous draw.

The base product number STM32F437 covers a range of density and package variants; if a future redesign needs a different footprint, the STM32F4 family keeps the same core and peripheral architecture.

STM32F437IIH6
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