STM32F429ZIY6TR

STMicroelectronics · STM32F4 Series

STMicroelectronics STM32F4 series STM32F429ZIY6TR, ARM Cortex-M4 32-bit MCU, 180MHz, 2MB Flash, 256K x 8 RAM, 114 I/O, CANbus/Ethernet/USB OTG, 143-WLCSP, -40°C to 85°C.

STMicroelectronics STM32F429ZIY6TR
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MOQ 1 · Tape & Reel (TR) Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

STM32F429ZIY6TR specifications
Parameter / AttributeSpecification / Value
SeriesSTM32F4
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed180MHz
PackageTape & Reel (TR) Cut Tape (CT)
RAM size256K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, SPI, UART/USART, USB OTG
Number of i (O)114
Core processorARM® Cortex®-M4
Case143-UFBGA, WLCSP
Data convertersA/D 24x12b; D/A 2x12b
Program memory size2MB (2M x 8)

Technical details

143-WLCSP — what the package means for the board

The STM32F429ZIY6TR is an STMicroelectronics STM32F4-series MCU built around an ARM Cortex-M4 core clocked at 180 MHz, with 2 MB of Flash and 256 KB of SRAM. The 114 GPIOs, LCD controller, Ethernet MAC, and dual 12-bit DACs put this part squarely in the human-machine-interface and connectivity tier: think touch-screen panels, industrial gateways, and embedded vision systems where you need a display and a network stack on a single chip.

180 MHz Cortex-M4 — bus margin and memory headroom

The 2 MB Flash is large enough to hold a full embedded display framebuffer plus application code without external memory for many designs. The 256 KB SRAM handles the typical Ethernet and USB buffers, but if you are running a high-resolution TFT with double buffering, budget for external SDRAM over the flexible memory controller. The 12-bit ADC bank (24 channels) and dual 12-bit DACs cover analog front-end tasks without an external converter.

Industrial temperature, active lifecycle

The product status is Active, and it carries ROHS3 compliance.

The 143-WLCSP is a direct-attach package with no leads and no exposed paddle — the solder balls are the only mechanical and electrical connection. That means the PCB land pattern must match the 4.52 x 5.55 mm ball array exactly, and rework requires a hot-air station with a fine nozzle and a preheat plate to avoid warping the thin substrate. Underfill is recommended for any product that sees vibration or thermal cycling.

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