180 MHz Cortex-M4 with 2 MB Flash — the HMI and industrial-control workhorse
It carries 2 MB of Flash and 256 KB of SRAM, enough for a full graphics frame buffer, an Ethernet TCP/IP stack, and a real-time OS without external memory.
Connectivity and I/O budget for system-level integration
The EBI allows glueless connection to SRAM, NOR Flash, or FPGA-style peripherals.
Package and board-level fit — 176+25 UFBGA
Housed in a 176+25 UFBGA (10x10 mm) package, this is a fine-pitch BGA with 0.5 mm ball pitch. The PCB requires at least four layers, micro-vias or laser-drilled vias for fanout, and a controlled-impedance stack if Ethernet is used. The 25 extra balls in the centre are typically power/ground — plan for a solid via array under the package to keep inductance low. Operating temperature range is -40 to 85 °C, covering industrial environments but not extended automotive under-hood.