STM32F407IGH6TR

STMicroelectronics · STM32F4 Series

STMicroelectronics STM32F4 series, ARM Cortex-M4 32-bit MCU, 168MHz, 1MB Flash, 192K x 8 SRAM, CANbus, Ethernet, I²C, SPI, UART/USART, USB OTG, A/D 24x12b; D/A 2x12b, -40°C ~ 85°C, 176+25UFBGA (10x10).

STMicroelectronics STM32F407IGH6TR
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MOQ 1 · Tape & Reel (TR) Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

STM32F407IGH6TR specifications
Parameter / AttributeSpecification / Value
SeriesSTM32F4
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed168MHz
PackageTape & Reel (TR) Cut Tape (CT)
RAM size192K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
ConnectivityCANbus, DCMI, EBI/EMI, Ethernet, I²C, IrDA, LINbus, SPI, UART/USART, USB OTG
Number of i (O)140
Core processorARM® Cortex®-M4
Case201-UFBGA
Data convertersA/D 24x12b; D/A 2x12b
Program memory size1MB (1M x 8)

Technical details

Cortex-M4 at 168 MHz — the processing backbone

The STM32F407IGH6TR: ARM Cortex-M4 core at 168 MHz with FPU for DSP tasks; connectivity includes Ethernet, CAN, USB OTG, and DCMI.

Memory headroom and peripheral set

With 1 MB of Flash and 192 KB of SRAM, this MCU can host a full RTOS, TCP/IP stack, and application code without external memory in many designs.

The 176+25 UFBGA (10x10 mm) package is a fine-pitch BGA with 201 balls. The exposed thermal pad on the underside must be stitched to a ground plane with thermal vias to keep junction temperature within limits under continuous load.

STM32F407IGH6TR
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