STM32F103VDT7

STMicroelectronics

STMicroelectronics, STM32F1 series, 32-bit ARM Cortex-M3 MCU, STM32F103VDT7, 72MHz, 384KB Flash, 64K x 8 RAM, 80 I/O, 100-LQFP, -40°C to 105°C.

STMicroelectronics STM32F103VDT7
Download datasheet (PDF)
[IN STOCK] In Stock: 5 pcs
$23.24/ pc

Volume pricing

Buy Now

MOQ 1 · Tray · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

STM32F103VDT7 specifications
Parameter / AttributeSpecification / Value
SeriesSTM32F1
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2V ~ 3.6V
Operating temperature-40°C ~ 105°C (TA)
Speed72MHz
PackageTray
RAM size64K x 8
Core size32-Bit Single-Core
PeripheralsDMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
ConnectivityCANbus, I²C, IrDA, LINbus, SPI, UART/USART, USB
Number of i (O)80
Core processorARM® Cortex®-M3
Case100-LQFP
Data convertersA/D 16x12b; D/A 2x12b
Program memory size384KB (384K x 8)

Technical details

384 KB Flash — firmware headroom without the cost of a bigger die

The 384 KB Flash is a sweet spot in the STM32F103 density ladder: enough to hold a full application stack with a modest OTA staging buffer, without paying for the 512 KB or 1 MB variants. The 64K x 8 SRAM supports moderate data buffering and a real-time OS footprint. If your firmware image is pushing past 300 KB, this part keeps you out of external memory territory.

100-LQFP — layout and reflow considerations

The 100-LQFP (14x14 mm) package is a standard industrial MCU footprint. The 0.5 mm pitch requires a controlled impedance stackup if you're routing USB or CAN at full speed, but the pin-to-pin spacing is forgiving for two-layer boards with careful trace routing. No exposed pad — all thermal dissipation goes through the leadframe, so keep the ambient airflow in mind if the part is running near 105°C with most I/O switching.

ST lists this part as Active.

STM32F103VDT7
[ALLOC] verified
Quote