STM32F103R6H6A

STMicroelectronics

ST STM32F1 series, ARM Cortex-M3, 32-Bit Single-Core MCU, 72MHz, 32KB Flash, 10K x 8 RAM, 51 I/O, CANbus/I²C/SPI/USART/USB, 64-TFBGA, -40°C~85°C.

STMicroelectronics STM32F103R6H6A
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Technical specifications

STM32F103R6H6A specifications
Parameter / AttributeSpecification / Value
SeriesSTM32F1
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed72MHz
PackageTray
RAM size10K x 8
Core size32-Bit Single-Core
PeripheralsDMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
ConnectivityCANbus, I²C, IrDA, LINbus, SPI, UART/USART, USB
Number of i (O)51
Core processorARM® Cortex®-M3
Case64-TFBGA
Data convertersA/D 16x12b
Program memory size32KB (32K x 8)

Technical details

72 MHz ARM Cortex-M3 in a 5×5 mm BGA — what this MCU delivers

The STM32F103R6H6A is a 32-Bit Single-Core ARM Cortex-M3 MCU with a 72 MHz core, 32 KB Flash, 10K x 8 RAM, and 51 I/O in a 64-TFBGA (5x5 mm) package.

Flash and RAM sizing — what fits in 32 KB / 10 KB

The 10 KB SRAM is enough for moderate-sized buffers and real-time data structures, but complex RTOS-based designs with large frame buffers or extensive lookup tables will push the memory ceiling. If your application needs more code space or RAM, the STM32F103 family offers pin-compatible higher-density options (e.g., 64 KB or 128 KB Flash variants) that drop into the same 64-TFBGA footprint.

64-TFBGA — board-level considerations

The small ball pitch means routing out all 51 I/O plus power and ground needs at least a four-layer board for most designs. The compact footprint saves board area compared to an LQFP-64, at the cost of more complex rework and inspection.

The STM32F103 series is a mature platform with active lifecycle status.

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