STM32F100VCT6BTR

STMicroelectronics · STM32F1 Series

STMicroelectronics STM32F1 series ARM Cortex-M3 32-bit MCU, STM32F100VCT6BTR, 24 MHz, 256 KB flash, 24 KB RAM, 80 I/O, 100-LQFP.

STMicroelectronics STM32F100VCT6BTR
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[IN STOCK] In Stock: 4 pcs
$15.57/ pc

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MOQ 1 · Tape & Reel (TR) Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

STM32F100VCT6BTR specifications
Parameter / AttributeSpecification / Value
SeriesSTM32F1
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed24MHz
PackageTape & Reel (TR) Cut Tape (CT)
RAM size24K x 8
Core size32-Bit Single-Core
PeripheralsDMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
ConnectivityI²C, IrDA, LINbus, SPI, UART/USART
Number of i (O)80
Core processorARM® Cortex®-M3
Case100-LQFP
Data convertersA/D 16x12b; D/A 2x12b
Program memory size256KB (256K x 8)

Technical details

ARM Cortex-M3 at 24 MHz — fit for control-loop and sensor-fusion tasks

The STM32F100VCT6BTR is an STMicroelectronics STM32F1 series microcontroller built around a 32-bit ARM Cortex-M3 core clocked at 24 MHz. That clock rate delivers enough throughput for real-time control loops — motor commutation, sensor fusion, or UART-driven protocol stacks — without the power penalty of a higher-frequency sibling. The 256 KB of on-chip flash and 24 KB of SRAM hold a moderate application image plus stack; the 80 general-purpose I/O lines give headroom for parallel displays or a bank of discrete inputs.

Peripheral set and deployment context

On-chip peripherals include DMA, multiple PWM channels, a temperature sensor, and a watchdog timer — the usual building blocks for a sensor-to-actuator chain. The integrated A/D converter reads 16 channels at 12-bit resolution, and the two D/A converters output 12-bit analog signals — enough for closed-loop analog control without an external DAC. The operating temperature range spans -40°C to 85°C, which covers most industrial enclosures, HVAC zones, and outdoor telecom cabinets.

Package and board integration

The supplier device package is 100-LQFP (14x14), which matches the standard STM32F1 footprint; no exposed pad means the thermal path is through the leads, so forced air or a heatsink is needed if the die dissipates more than a few hundred milliwatts.

No stock-holding claim is made; the supply posture is per-RFQ confirmation. The part is not single-sourced; the STM32F1 family has multiple pin-compatible variants for capacity hedging.

STM32F100VCT6BTR
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