The input capacitance is 2700 pF at 100 V drain bias, which influences the Miller plateau duration and the switching loss profile.
Package and thermal — I2PAKFP full-pack isolation
The TO-262 full-pack (I2PAKFP) through-hole package provides full isolation between the die and the heatsink — no insulating pad is needed, simplifying assembly. The through-hole mounting suits designs where vibration resistance and manual rework are priorities over board density.
Lifecycle — officially obsolete
Buyers should verify the remaining shelf stock and consider qualifying a pin-compatible alternative if the design allows.
