600 V, 11 A, 380 mOhm — the key ratings
The ±25 V maximum gate-source rating gives good margin for ringing on the gate node.
Through-hole I2PAKFP — mounting and thermal notes
The STFI13N60M2 comes in a TO-262-3 Full Pack (I²Pak) through-hole package, also designated I2PAKFP (TO-281). The through-hole leads suit wave-soldering and manual rework. Maximum power dissipation is 25 W at case temperature, so a heatsink with good thermal interface is expected for continuous operation above a few amps.
