650 V, 5 A — what this MDmesh MOSFET brings to a power stage
Obsolete — what it means for sourcing
TO-220FP full-pack — the isolated-tab advantage
This eliminates the need for an insulating pad or washer between the device and a heatsink, simplifying assembly and reducing the BOM count. The trade-off is higher thermal resistance from junction to case, which the 20 W power dissipation rating reflects. For a flyback or PFC stage dissipating 10–15 W, the full-pack package works well with a clip-on or screw-mounted heatsink. The through-hole mounting suits boards where wave solder or hand assembly is the process.
