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STMicroelectronics STF42N65M5 — Discrete Semiconductors

STF42N65M5 N-Channel MOSFET, 650 V, 33 A, MDmesh V, TO-220FP

MPNSTF42N65M5
Active

STMicroelectronics MDmesh V N-Channel MOSFET, 650 V drain-source, 33 A continuous drain, 79 mOhm Rds(on) at 10 V gate drive, 100 nC gate charge, TO-220FP full-pack through-hole package, active production.

$5.9115Ref. price · indicative, final on quote
STMicroelectronics STF42N65M5 datasheet (PDF)
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

STF42N65M5 specifications
ParameterValue
SeriesMDmesh™ V
FET typeN-Channel
MountingThrough Hole
Drain to source voltage650 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C33A (Tc)
Power dissipation40W (Tc)
Operating temperature150°C (TJ)
PackageTube
Vgs±25V
TechnologyMOSFET (Metal Oxide)
CaseTO-220-3 Full Pack
Vgs(th) (Max) @ id5V @ 250µA
Rds on (Max) @ id, vgs79mOhm @ 16.5A, 10V
Gate charge (Qg) (Max) @ vgs100 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds4650 pF @ 100 V

Product details

STMicroelectronics lists the STF42N65M5 as Active.

Package and thermal considerations

The TO-220FP (full-pack) package is a through-hole, fully isolated tab — no mica washer or silicone pad between the device and the heatsink. The maximum junction temperature is 150°C, and the case-limited power dissipation is 40 W. For continuous operation near the 33 A rating, a heatsink with adequate thermal interface is required; the full-pack's junction-to-case thermal resistance is higher than a standard TO-220, so derate accordingly. The ±25 V maximum gate-source voltage is typical for this class; a 10 V gate drive is specified for the rated Rds(on).

Frequently asked questions

What is the difference between STF42N65M5 and STB42N65M5?

The STF42N65M5 uses the TO-220FP full-pack (fully isolated) package, while the STB42N65M5 uses the D2PAK surface-mount package. The die and electrical ratings (650 V, 33 A, 79 mOhm) are the same. The TO-220FP is preferred for through-hole assembly with direct-to-heatsink mounting; the D2PAK suits reflow-soldered, high-volume production.