Package and mounting — DPAK for automated assembly
The DPAK (TO-252) footprint is a standard surface-mount package for medium-power MOSFETs, compatible with reflow soldering and pick-and-place lines. The tab is the drain terminal; PCB layout should allocate sufficient copper area for thermal dissipation — the device is rated for 90 W power dissipation at case temperature, so a thermal via pattern under the tab is recommended for continuous operation above 3 A. The supplier device package is listed as DPAK, and the base product number is STD6N95.
Lifecycle and sourcing
The STD6N95K5 carries an active product status — no last-time-buy or end-of-life notice is in effect. It can be specified into new designs with confidence.