600 V MDmesh™ N-Channel MOSFET in an IPak through-hole package
Buyers should evaluate pin-compatible alternatives within the MDmesh™ family for new designs, though no specific second-source alternate is documented here.
1.5 Ohm Rds(on) — conduction loss and thermal design
At 1.5 A, the I²R loss is approximately 3.4 W, which must be managed within the 42 W power dissipation limit at the case. The gate drive voltage of 10 V is required to achieve the specified Rds(on); operating at lower gate voltages will increase on-resistance significantly. The 14 nC gate charge is moderate, allowing direct drive from a PWM controller or gate driver without excessive switching losses in low-frequency applications.
Through-hole IPak — mounting and thermal considerations
The TO-251-3 (IPak) package is a through-hole variant with short leads, designed for vertical mounting on a PCB. The IPak footprint is similar to the DPAK (TO-252) but with leads for through-hole soldering, offering better mechanical retention in high-vibration environments.