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STMicroelectronics STD2LN60K3 — Discrete Semiconductors

STD2LN60K3 N-Ch 600V 2A MOSFET, SuperMESH3 DPAK

MPNSTD2LN60K3
Active

STMicroelectronics STD2LN60K3 SuperMESH3™ N-Channel MOSFET, 600 V, 2 A, DPAK-3 (TO-252), 4.5 Ohm Rds(on) at 10 V, 12 nC gate charge, ROHS3 compliant.

$0.8700Ref. price · indicative, final on quote
PackagingTO-252-3, DPak (2 Leads + Tab), SC-63
RoHSROHS3 Compliant
SeriesSuperMESH3™
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

STD2LN60K3 specifications
ParameterValue
SeriesSuperMESH3™
FET typeN-Channel
MountingSurface Mount
Drain to source voltage600 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C2A (Tc)
Power dissipation45W (Tc)
Operating temperature150°C (TJ)
PackageTape & Reel (TR) Cut Tape (CT)
Vgs±30V
TechnologyMOSFET (Metal Oxide)
CaseTO-252-3, DPak (2 Leads + Tab), SC-63
Vgs(th) (Max) @ id4.5V @ 50µA
Rds on (Max) @ id, vgs4.5Ohm @ 1A, 10V
Gate charge (Qg) (Max) @ vgs12 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds235 pF @ 50 V

Product details

Medium-voltage offline switching in a low-charge DPAK

The STD2LN60K3 is an N-channel 600 V, 2 A MOSFET from STMicroelectronics' SuperMESH3 series, built for medium-voltage offline converters and auxiliary power stages where gate-drive efficiency and thermal management in a compact surface-mount package matter more than raw current capacity. With a typical gate charge of 12 nC at 10 V and an input capacitance of 235 pF at 50 V Vds, the switching losses stay low enough that a small-signal driver can push the gate without a dedicated buffer stage — useful in flyback and PFC aux windings where every milliwatt of drive power counts.

Rds(on) and thermal budget for the real load

The 4.5 Ohm maximum on-resistance at 1 A, 10 V means that at the 2 A continuous drain rating the conduction loss hits about 18 W (I²R) before junction temperature rise — the 45 W case-temperature power dissipation limit leaves headroom only if the PCB copper area under the DPAK tab sinks the heat effectively. The 150 °C maximum junction temperature sets the derating ceiling; a real design should budget the junction rise to 125 °C or lower to stay inside the safe operating area over the full ambient range.

Package and mounting reality for the layout

The DPAK (TO-252-3) surface-mount package with a single exposed tab requires a thermal land pattern on the PCB that connects the drain pad to a copper pour — the tab is the primary heat path, not the leads. The ±30 V maximum gate-source voltage means the gate drive must never exceed that rail, even during transients — a 12 V gate drive is safe, but a bootstrap supply that rings above 30 V during switching will punch the oxide.