STMicroelectronics SuperMESH™ N-Channel MOSFET, 600 V drain-source, 2 A continuous drain current, 4.8 Ohm on-resistance at 1 A and 10 V gate drive, DPAK surface-mount package.
| Parameter | Value |
|---|---|
| Series | SuperMESH™ |
| FET type | N-Channel |
| Mounting | Surface Mount |
| Drain to source voltage | 600 V |
| Drive voltage (Max rds on, min rds on) | 10V |
| Current - continuous drain (Id) @ 25°C | 2A (Tc) |
| Power dissipation | 45W (Tc) |
| Operating temperature | -55°C~150°C(TJ) |
| Package | Tape & Reel (TR); Cut Tape (CT) |
| Vgs | ±30V |
| Technology | MOSFET (Metal Oxide) |
| Case | TO-252-3, DPak (2 Leads + Tab), SC-63 |
| Vgs(th) (Max) @ id | 4.5V @ 50µA |
| Rds on (Max) @ id, vgs | 4.8Ohm @ 1A, 10V |
| Gate charge (Qg) (Max) @ vgs | 15 nC @ 10 V |
| Input capacitance (Ciss) (Max) @ vds | 280 pF @ 25 V |
The STD2HNK60Z: Gate drive of 10 V is recommended for minimum on-resistance; threshold voltage maxes at 4.5 V at 50 µA.
The DPAK (TO-252) surface-mount package with the tab as the drain connection is the standard footprint for this power level. The 45 W power dissipation at case temperature assumes the tab is soldered to a copper area on the PCB that acts as the heatsink.
Design engineers need the complete electrical characteristics and package details to validate the part fits their circuit.
Sourcing buyers need real-time pricing and availability to fill BOM line items quickly and avoid production delays.
Immediate stock information affects lead time decisions and whether the part can be procured without extended delays.
Maintenance techs and brokers need a drop-in substitute when the exact part is unavailable or at end of life.
Surface-mount assembly requires tape and reel format; buyers must confirm packaging matches their pick-and-place equipment.
Thermal management is critical for power MOSFETs; engineers need this spec to ensure reliability under load.