STD17NF25

STMicroelectronics · STripFET™ II Series

STMicroelectronics STripFET™ II N-Channel MOSFET, STD17NF25, 250 Vdss, 17 A Id, 165 mOhm Rds(on), DPAK (TO-252) surface mount, Tape & Reel.

STMicroelectronics STD17NF25
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Technical specifications

STD17NF25 specifications
Parameter / AttributeSpecification / Value
SeriesSTripFET™ II
FET typeN-Channel
MountingSurface Mount
Drain to source voltage250 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C17A (Tc)
Power dissipation90W (Tc)
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR) Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
CaseTO-252-3, DPak (2 Leads + Tab), SC-63
Vgs(th) (Max) @ id4V @ 250µA
Rds on (Max) @ id, vgs165mOhm @ 8.5A, 10V
Gate charge (Qg) (Max) @ vgs29.5 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds1000 pF @ 25 V

Technical details

250 V, 17 A switching load ceiling

The STD17NF25 is an N-channel power MOSFET from STMicroelectronics' STripFET™ II series, rated for 250 V drain-source breakdown and 17 A continuous drain current at 25°C case temperature. This puts it in the medium-voltage, moderate-current class — suitable for switching loads in offline power supplies, DC-DC converters, and motor pre-drive stages where the bus rail sits at 48 V to 150 V and the peak current stays under the 17 A ceiling.

Conduction loss and gate drive budget

Maximum on-resistance is 165 mOhm at 8.5 A drain current with a 10 V gate drive. At 17 A the Rds(on) will be higher due to self-heating — the 90 W power dissipation limit at the case is the thermal budget that governs the real-world current derating. The 29.5 nC total gate charge at 10 V means the gate driver must supply roughly 2.95 mA per 100 kHz of switching frequency just to charge the gate capacitance; the 1000 pF input capacitance at 25 V drain-source adds to the switching loss calculation.

DPAK thermal and mounting

Housed in the DPAK (TO-252) surface-mount package with an exposed drain tab. The tab must be soldered to a copper pad on the PCB — the thermal resistance to ambient depends on the board's copper area and layer count. The -55°C to 150°C junction temperature range covers industrial ambient and under-hood automotive environments, but the 150°C upper limit means the thermal design must keep the junction below that at full load.

STD17NF25
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