STMicroelectronics MDmesh™ II series, N-Channel MOSFET, 500 V Vdss, 8.5 A Id @ 25°C, 470 mOhm Rds(on) @ 4.5 A, 10 V, 19 nC Qg, DPAK (TO-252) surface mount.
| Parameter | Value |
|---|---|
| Series | MDmesh™ II |
| FET type | N-Channel |
| Mounting | Surface Mount |
| Drain to source voltage | 500 V |
| Drive voltage (Max rds on, min rds on) | 10V |
| Current - continuous drain (Id) @ 25°C | 8.5A (Tc) |
| Power dissipation | 70W (Tc) |
| Operating temperature | 150°C (TJ) |
| Package | Tape & Reel (TR) Cut Tape (CT) |
| Vgs | ±25V |
| Technology | MOSFET (Metal Oxide) |
| Case | TO-252-3, DPak (2 Leads + Tab), SC-63 |
| Vgs(th) (Max) @ id | 4V @ 250µA |
| Rds on (Max) @ id, vgs | 470mOhm @ 4.5A, 10V |
| Gate charge (Qg) (Max) @ vgs | 19 nC @ 10 V |
| Input capacitance (Ciss) (Max) @ vds | 547 pF @ 50 V |
Rds(on) of 470 mOhm at 4.5 A, 10 V; 70 W package power limit (Tc). Input capacitance 547 pF at 50 V.
The DPAK (TO-252) package has three leads plus the exposed drain tab.
Buyers need to verify electrical specifications and pinout before design.
Critical for long-term availability and lifecycle planning.
Buyers need to source the part from reliable distributors.
When part is unavailable, cross-reference is essential for substitution.
For BOM costing and procurement planning.
Design engineers need to ensure footprint compatibility.