At 60 A continuous drain current (Tc) the die is sized for sustained loads, but the package's 100 W dissipation limit means the board layout must sink that heat: a solid copper pour under the DPAK tab and a via array to inner layers are required to stay inside the SOA at elevated ambient temperatures. The 4.8 mΩ Rds(on) at 10 V gate drive is the headline figure for conduction-loss budgeting; note the minimum drive voltage for rated on-resistance is 5 V, and at 5 V the Rds(on) will be higher — the datasheet's typical curve (page 5) shows roughly 1.5× the 10 V value, so a 5 V gate signal should be verified against the load current and thermal rise.
STMicroelectronics no longer manufactures this part in volume.