300 V, 42 A switching — STripFET™ II N-channel in D²PAK
The STB46NF30: The D²PAK (TO-263) surface-mount package suits automated assembly on power-stage PCBs where the exposed tab carries the drain and the copper area on the board sets the thermal dissipation.
Total gate charge Qg is 90 nC at Vgs = 10 V, which determines the average gate-drive current required at the target switching frequency. Input capacitance Ciss is 3200 pF at Vds = 25 V; this capacitance, together with the gate-drive source impedance, sets the turn-on and turn-off delay times and the cross-conduction window in a half-bridge topology.
Thermal and environmental range
Junction temperature range extends from -55°C to 175°C, qualifying the part for industrial and automotive environments where ambient heat and self-heating from high-current switching push the die temperature well above the board temperature. Maximum power dissipation is 300 W at the case temperature — the actual continuous dissipation in the application is derated by the junction-to-case thermal resistance and the board's ability to sink heat from the D²PAK tab.