300 V, 42 A switching — STripFET™ II N-channel in D²PAK
The STB46NF30: The D²PAK (TO-263) surface-mount package suits automated assembly on power-stage PCBs where the exposed tab carries the drain and the copper area on the board sets the thermal dissipation.
Gate charge and switching budget
Total gate charge Qg is 90 nC at Vgs = 10 V, which determines the average gate-drive current required at the target switching frequency. Input capacitance Ciss is 3200 pF at Vds = 25 V; this capacitance, together with the gate-drive source impedance, sets the turn-on and turn-off delay times and the cross-conduction window in a half-bridge topology.
Thermal and environmental range
Junction temperature range extends from -55°C to 175°C, qualifying the part for industrial and automotive environments where ambient heat and self-heating from high-current switching push the die temperature well above the board temperature. Maximum power dissipation is 300 W at the case temperature — the actual continuous dissipation in the application is derated by the junction-to-case thermal resistance and the board's ability to sink heat from the D²PAK tab.