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ROHM Semiconductor BU52097GWZ-E2 — Microcontrollers & Processors (MCU / MPU / DSP)

BU52097GWZ-E2 Hall Effect Omnipolar Switch, 1.65V-3.6V

MPNBU52097GWZ-E2
End of Life

ROHM BU52097GWZ-, Omnipolar Hall Effect Switch, ±17mT Trip / ±12.1mT Release, CMOS Output, 1.65V-3.6V Supply, 8µA Supply Max, -40°C to 85°C, 4-XFBGA/CSPBGA, Tape & Reel.

$0.72Ref. price · indicative, final on quote
Packaging4-XFBGA, CSPBGA
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

BU52097GWZ-E2 Technical Specifications
ParameterValue
Output typeCMOS
Mounting typeSurface Mount
Voltage1.65V ~ 3.6V
Current - output500µA
Current - supply8µA
Operating temperature-40°C ~ 85°C
PackageTape & Reel (TR); Cut Tape (CT)
FunctionOmnipolar Switch
TechnologyHall Effect
PolarizationNorth Pole, South Pole
Sensing range±17mT Trip, ±12.1mT Release
Case4-XFBGA, CSPBGA
Test condition25°C

Product details

The BU52097GWZ-E2: The BU52097GWZ-: The ROHM BU52097GWZ- is an omnipolar Hall-effect magnetic switch that responds to both north and south poles, with a typical trip point of ±17 mT and release at ±12.1 mT. This means a single magnet orientation works for lid-close detection, rotation sensing, or proximity triggers — no need to align pole direction on the assembly line. The CMOS output swings rail-to-rail and sinks or sources up to 500 µA, enough to drive a GPIO or a small load directly. Maximum quiescent supply current is just 8 µA, making this a candidate for always-on sensing in battery-operated devices like portable electronics, IoT endpoints, and wearable accessories.

Package reality: 4-bump CSPBGA

The BU52097GWZ- comes in a 4-XFBGA / CSPBGA package — essentially four solder bumps on a 0.5 mm or finer pitch. This is a tiny footprint (roughly 0.9 mm x 0.9 mm body) that saves board area but demands X-ray inspection for solder-joint verification and a controlled reflow profile. No exposed pad to stitch; the bumps carry both signal and mechanical attachment. If your rework lab isn't set up for BGA-style parts, factor in the assembly learning curve or a pre-programmed pick-and-place service.

Sourcing and lifecycle

ROHM lists the BU52097GWZ- as Active in production. The part is ROHS3 compliant, which satisfies EU and most global environmental requirements without an exemption expiry.

Frequently asked questions

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Is BU52097GWZ-E2 equivalent to AH180?

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Is BU52097GWZ-E2 still in production?

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What are the pinout and package dimensions of BU52097GWZ-E2?

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