BD733L2EFJ-CE2

ROHM Semiconductor · Automotive, AEC-Q100 Series

ROHM Semiconductor BD733L2EFJ-CE2 automotive LDO, fixed 3.3V output, 200mA, 45V input max, 63dB PSRR at 120Hz, AEC-Q100, 8-SOIC exposed pad, -40°C to 125°C.

ROHM Semiconductor BD733L2EFJ-CE2
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

BD733L2EFJ-CE2 specifications
Parameter / AttributeSpecification / Value
SeriesAutomotive, AEC-Q100
Output typeFixed
MountingSurface Mount
Voltage - input45V
Voltage dropout1V @ 200mA
Voltage - output (Min (Fixed))3.3V
Output current200mA
Current - supply15 µA
Current - quiescent6 µA
Operating temperature-40°C ~ 125°C
PSRR63dB (120Hz)
PackageTape & Reel (TR); Cut Tape (CT)
Case8-SOIC (0.154\", 3.90mm Width) Exposed Pad
Protection featuresOver Current, Over Temperature
Number of regulators1
Output configurationPositive

Technical details

The ROHM BD733L2EFJ-CE2 is a fixed 3.3 V output LDO rated for 200 mA continuous output current, housed in an 8-SOIC exposed-pad package.

Input range, dropout, and quiescent current

The 45 V maximum input voltage provides margin above the nominal 12 V or 24 V automotive bus — a 60 V load-dump transient on a 12 V system stays within the absolute-max rating without an external clamp. Quiescent current is 6 µA typical, with a maximum supply current of 15 µA. This low standing current suits always-powered modules such as a body-controller CAN transceiver or a keyless-entry receiver that must draw microamps in sleep mode.

Protection and package integration

Over-current and over-temperature protection are integrated — no external supervisory IC or reset generator is needed for the basic fault response. The 8-SOIC exposed-pad package (8-HTSOP-J) requires a thermal-land pattern on the PCB to conduct heat from the die to the board; the datasheet's recommended copper area under the pad sets the junction-to-ambient thermal resistance.

BD733L2EFJ-CE2
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