600 V, 10 A — the through-hole workhorse for offline power
The TO-220 Full Pack (TO-220FP) isolates the tab from the drain, so no mica washer or insulating pad is needed when bolting to a chassis or heatsink — but the 30 W maximum power dissipation means the thermal path through the full-pack epoxy limits how much heat can be sunk before the 150 °C junction temperature ceiling is hit.
Package and mounting — TO-220FP through-hole
Through-hole TO-220-3 Full Pack, supplier device package TO-220FP — the three leads are 0.025-inch thick and sit on 0.100-inch pitch, standard for hand-solder or wave-solder assembly on single-sided or double-sided boards. Shipped in Tube — not tape-and-reel, so pick-and-place is not an option; this is a bench-assembly, repair, or low-volume production part.
ROHS3 compliant — no exemptions for lead in solder or other restricted substances, so it passes into European and RoHS-regulated markets without paperwork issues.
Gate drive and switching — what the numbers mean
Gate charge is 30 nC at 10 V — a 10 V gate-drive rail can switch this FET at 100 kHz with about 3 mA average gate-drive current, well within the capability of a standard bootstrap driver. Input capacitance Ciss is 1100 pF at 25 V — this is moderate; the gate-driver output impedance and series gate resistor should be sized to keep the rise/fall times under 100 ns for hard-switching topologies. The ±30 V Vgs maximum gives headroom for gate-drive transients — common in flyback and half-bridge designs where the gate drive can overshoot the 15 V rail on turn-off edges.