The 45 W power dissipation ceiling at the case means the junction temperature stays under 150°C only if the PCB copper area under the exposed pad pulls the heat out; a 2-layer board with minimal copper won't cut it at full current.
Gate charge and switching — 25 nC at 4.5 V
Total gate charge is 25 nC at 4.5 V, which keeps the gate-drive power low in a high-frequency converter. The input capacitance of 4720 pF at 10 V drain-source sets the Miller plateau timing — a 1 A gate driver charges the gate in about 25 ns, so the switching edge is clean enough for a 300–500 kHz buck stage.
Package and rework — 8-PowerVDFN (WPAK 3F 5x6)
The package is an 8-lead PowerVDFN with an exposed pad, supplier device code WPAK(3F) measuring 5x6 mm. Reflow profile follows the standard lead-free curve for a VDFN package; the plastic body is moisture-sensitive, so a bake cycle before rework is mandatory if the parts have been exposed to ambient humidity beyond the floor-life. The 150°C junction rating gives headroom for rework with a hot-air station, but the thermal mass of the pad means a bottom-side preheat helps avoid cold joints.