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Renesas Electronics R5F572MDHDFB#30 — DC-DC Power Modules

R5F572MDHDFB#30 Renesas RX 32-bit MCU, 240 MHz, 2 MB Flash

MPNR5F572MDHDFB#30
End of Life

Renesas RX series R5F572MDHDFB#30, 32-bit RXv3 MCU, 240 MHz, 2 MB Flash, 1 MB SRAM, 32 KB EEPROM, 111 I/O, CAN/Ethernet/USB OTG, 144-LQFP, -40 to 85°C.

$15.8Ref. price · indicative, final on quote
Packaging144-LQFP
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
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Specifications

R5F572MDHDFB#30 Technical Specifications
ParameterValue
SeriesRX
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.7V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed240MHz
PackageTray
RAM size1M x 8
Core size32-Bit
EEPROM size32K x 8
PeripheralsDMA, LCD, LVD, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Number of i (O)111
Core processorRXv3
Case144-LQFP
Data convertersA/D 29x12b; D/A 2x12b
Program memory size2MB (2M x 8)

Product details

The R5F572MDHDFB#30 is a Renesas RX-series 32-bit microcontroller built around the RXv3 CPU core running at 240 MHz. That clock rate is the top end of the RX family — 50% faster than the 160 MHz RXv3 parts in the same series — and directly translates to tighter control-loop bandwidth and higher throughput for protocol stacks. The core is backed by 2 MB of Flash and 1 MB of SRAM, enough to hold a full Ethernet + USB + CANopen stack with a graphics frame buffer left over. An integrated 32 KB EEPROM array eliminates the external serial EEPROM for parameter storage, saving board area and a BOM line.

Peripheral set for industrial connectivity and HMI

This MCU carries a connectivity lineup that matches an industrial gateway or a human-machine interface controller: CANbus, Ethernet, USB OTG, QSPI, multiple SCI/UART and SPI/I²C channels, plus an EBI/EMI bus for external memory or FPGA attachment. The 111 general-purpose I/O pins in the 144-LQFP package give plenty of headroom for parallel displays, keypads, and sensor arrays. On-chip data converters include 29 analog inputs at 12-bit resolution and two 12-bit DAC outputs, covering analog sensor readout and set-point generation without external converters.

Package and footprint notes

Supplied in a 144-LQFP package (supplier device package 144-LFQFP, 20x20 mm body) with a 0.5 mm pitch. Surface-mount assembly with standard reflow profiles;.

Lifecycle and compliance

Renesas lists the R5F572MDHDFB#30 as an active, current-production device.

Frequently asked questions

Does R5F572MDHDFB#30 support CANbus and Ethernet interfaces?

Yes, the connectivity block includes CANbus and Ethernet controllers, along with USB OTG, QSPI, SCI, SPI, I²C, SSI, MMC/SD, and an EBI/EMI bus for external memory.

What is the closest functional second-source for R5F572MDHDFB#30?

The R5F566TAAGFP#30 is a same-series RXv3 MCU with a similar peripheral set (CAN, I²C, SPI, SCI, DMA, PWM) but runs at 160 MHz, has 72 I/O, and is packaged in a smaller footprint. It is not a pin-compatible drop-in — the 144-LQFP package and 111 I/O of the R5F572MDHDFB#30 are unique to this density tier. For a direct replacement, stick with the exact ordering code.