Industrial temperature grade and package
Rated for -40°C to 105°C ambient, this MCU fits outdoor telecom cabinets, factory-floor enclosures, and engine-bay-adjacent electronics without a heatsink. The 64-LQFP package (10x10 mm body) is a common footprint for mid-density control boards.
Peripherals and connectivity
On-chip peripherals include capacitive touch sensing, DMA, LVD, POR, PWM, and WDT — enough to run a standalone control node without external supervisor ICs. The connectivity set covers I²C, LINbus, QSPI, SCI, SPI, and USB. The USB port is the notable addition for this class: it enables direct PC connection for firmware updates, data logging, or HMI configuration without an external UART-to-USB bridge. The 10-channel 12-bit ADC handles analog inputs like potentiometers, current shunts, or thermistor strings.
Lifecycle and sourcing posture
The R5F56719HGFM#30 carries an Active lifecycle status with ROHS3 compliance. No last-time-buy or obsolescence notice is on record, so it is safe to specify for new designs and production BOMs. For dual-sourcing resilience, the RX671 family includes pin-compatible density variants — the same 64-LQFP footprint — but no official second-source alternate is listed in the ledger.