VersaClock 5 clock generator — what it does on the board
The Renesas 5P49V5925B000NLGI8 is a VersaClock® 5 programmable clock generator with an integrated PLL, designed to synthesize up to four LVCMOS output clocks from a single reference. It accepts differential or single-ended inputs including HCSL, LVCMOS, LVDS, LVPECL, or a crystal, and delivers a clean 200 MHz maximum output frequency. The 2:4 input-to-output ratio means you can distribute two reference sources across four clock lanes, useful for splitting a system clock and a separate Ethernet or PCIe reference without a second PLL IC. Housed in a 24-VFQFN exposed-pad package (4x4 mm body), it fits tight PCIe card or small-form-factor designs where board area is constrained. The industrial temperature range (-40°C to 85°C) covers motor drives, outdoor telecom, and factory automation enclosures where the ambient can swing.
Supply voltage flexibility — three rail domains in one part
This clock generator accepts supply voltages across three distinct ranges: 1.71V to 1.89V (1.8V nominal), 2.375V to 2.625V (2.5V nominal), and 3.135V to 3.465V (3.3V nominal). That triple-domain support means the same BOM line can serve a 1.8V FPGA bank, a 2.5V SerDes reference, or a 3.3V legacy logic system without a separate level translator or regulator — a real advantage when consolidating clock trees across mixed-voltage designs.
PLL and output architecture — what the 200 MHz ceiling means
The integrated PLL multiplies the input reference up to 200 MHz, with a divider chain on the output side (divider present, no multiplier). The single-circuit PLL is sufficient for most single-frequency-domain applications; if you need independent PLLs for asynchronous clock domains, you step up to a multi-PLL VersaClock variant. The LVCMOS-only output means this part drives standard CMOS logic, not differential lines — pair it with a fanout buffer if you need LVDS or LVPECL distribution downstream.
Lifecycle and compliance — active, ROHS3, no LTB risk
It is fully ROHS3 compliant, so it passes EU and global environmental requirements without an exemption certificate. For a production BOM, this part carries no forced-migration risk in the near term — no need to qualify a drop-in replacement unless the design requires dual sourcing.
Package and footprint — 24-QFN with exposed pad
The 24-VFQFN package (4x4 mm, 0.5 mm pitch) has an exposed thermal pad that must be soldered to a ground-plane via array for adequate heat dissipation. The supplier device package is 24-QFN (4x4).