Package and mounting
The 20-lead CDIP (0.300-inch body width, 7.62 mm) is a through-hole ceramic package. It requires a socket or soldered through-hole on the PCB — no surface-mount option exists for this order code. The hermetic ceramic construction is the reason this part is chosen over a plastic SOIC or TSSOP: it survives moisture, outgassing, and thermal cycling that would crack a plastic package. If your board is all SMT, this part forces a mixed-technology assembly step.
Lifecycle and compliance
It is RoHS non-compliant, meaning it contains lead (Pb) in the solder finish or die-attach. For designs that must meet EU RoHS or similar regulations, this part is not an option unless an exemption applies (e.g., military/aerospace). For non-RoHS projects, the active status is a green light for new designs and volume procurement.
