FOD3150ASD

onsemi

onsemi FOD3150ASD, single-channel optoisolated gate driver, 5000 Vrms isolation, 3 A peak output, 60 ns rise/fall, 8-SMD gull wing, -40°C to 100°C

onsemi FOD3150ASD
[IN STOCK] In Stock: 1,603 pcs
$1.51/ pc

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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

FOD3150ASD specifications
Parameter / AttributeSpecification / Value
MountingSurface Mount
Voltage - isolation5000Vrms
Voltage - output supply15V ~ 30V
Voltage - forward (Vf)1.5V
Current - peak output3A
Current - output high, low2A, 2A
Current - DC forward (If)25 mA
Operating temperature-40°C ~ 100°C
Pulse width distortion300ns
Approval agencyUL
PackageTape & Reel (TR); Cut Tape (CT)
TechnologyOptical Coupling
Case8-SMD, Gull Wing
Channels1
Rise (Fall time)60ns, 60ns
Propagation delay tpLH (tpHL)500ns, 500ns
Common mode transient immunity20kV/µs

Technical details

Gate-drive isolation for 600–1200 V inverter legs

The FOD3150ASD is a single-channel optoisolated gate driver rated for 5000 Vrms isolation. The 3 A peak output drives the gate charge of medium-power IGBTs and MOSFETs, turning them on in 60 ns typical. Its common-mode transient immunity of 20 kV/µs minimum keeps the output state stable when the high-side switch sees a fast voltage step across the isolation barrier — a common failure mode in half-bridge and H-bridge topologies.

Parametric deep-dive: timing and drive strength

Propagation delay is 500 ns max for both tpLH and tpHL, with pulse-width distortion held to 300 ns max. These numbers set the dead-time margin in a phase-leg: a 500 ns propagation delay means the complementary gate signal must be delayed by at least that much plus the 300 ns distortion to avoid shoot-through. Output high/low current is 2 A each, symmetrical. The output supply range of 15 V to 30 V covers standard IGBT gate drive voltages. The LED forward voltage is 1.5 V typical, and the maximum forward current is 25 mA.

Lifecycle and sourcing status

ROHS3 compliant. No stock-holding claim; we quote to order.

Package fit and board layout

8-SMD gull-wing package. The 8-SMD supplier device package footprint matches standard SOIC-8 land patterns. The UL approval simplifies system-level safety certification.

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