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onsemi 6N136SDVM — Optoisolators

6N136SDVM onsemi Optoisolator 5000Vrms 8-SMD Gull Wing

MPN6N136SDVM
End of Life

onsemi 6N136SDVM single-channel optocoupler, DC input, transistor with base output, 5000Vrms isolation, 8-SMD Gull Wing package, surface mount, -40°C to 100°C operating range

$1.75Ref. price · indicative, final on quote
Packaging8-SMD, Gull Wing
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

6N136SDVM specifications
ParameterValue
Input typeDC
Output typeTransistor with Base
MountingSurface Mount
Voltage - isolation5000Vrms
Voltage - output20V
Voltage - forward (Vf)1.45V
Current - output (Channel)8mA
Current transfer ratio50% @ 16mA
Current - DC forward (If)25 mA
Operating temperature-40°C ~ 100°C
PackageTape & Reel (TR); Cut Tape (CT)
Case8-SMD, Gull Wing
Channels1
Turn on (Turn off time)250ns, 260ns

Product details

5000Vrms isolation for industrial bus isolation

The 6N136SDVM is a single-channel optocoupler from onsemi that provides 5000Vrms galvanic isolation between a DC input and a transistor-with-base output. This isolation rating is the primary reason to reach for this part in motor-drive I/O, PLC digital inputs, or any industrial interface where a ground potential difference could otherwise punch through a non-isolated buffer. It switches in 250ns (turn-on) and 260ns (turn-off) typical, which is fast enough to pass 2–3 MHz digital signals or PWM waveforms without excessive skew. The 19%–50% current transfer ratio at 16mA forward current means the output phototransistor will sink at least 3mA (19% of 16mA) — enough to drive a TTL or CMOS gate input directly, but check the logic family's input current threshold against the minimum CTR.

Surface-mount Gull Wing package and temperature range

Housed in an 8-SMD Gull Wing package (8-SMD body), this part is intended for reflow soldering on a standard surface-mount PCB. The Gull Wing leads provide a visible solder joint for inspection, which matters in high-reliability assemblies where a hidden joint under a package body is a risk.

Active production and ROHS3 compliance

Frequently asked questions

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