Package and PCB layout considerations
The 32-HVQFN (5x5 mm) with exposed pad requires a thermal-land pattern on the PCB with multiple vias to the ground plane.
Active lifecycle status from NXP; no EOL notice or last-time-buy window in effect.
TDA8035HN/C1,118
NXP Semiconductors
NXP TDA8035HN/C1,118 specialized interface IC, analog interface, 2.7V ~ 5.5V supply, 32-VFQFN Exposed Pad, 32-HVQFN (5x5 mm), surface mount, active lifecycle.
[IN STOCK] In Stock: 1,977 pcs
MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T
Technical specifications
| Parameter / Attribute | Specification / Value |
|---|---|
| Mounting | Surface Mount |
| Supply voltage | 2.7V ~ 5.5V |
| Interface | Analog |
| Package | Tape & Reel (TR); Cut Tape (CT) |
| Case | 32-VFQFN Exposed Pad |
Technical details
TDA8035HN/C1,118
[ALLOC] verified