S9KEAZN16AMLC

NXP Semiconductors · Kinetis KEA Series

NXP Semiconductors Kinetis KEA series, S9KEAZN16AMLC 32-bit ARM Cortex-M0+ MCU, 40 MHz, 16 KB Flash, 2 KB RAM, 256 B EEPROM, 16-ch 12-bit ADC, 32-LQFP package, -40°C to +125°C.

NXP Semiconductors S9KEAZN16AMLC
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Technical specifications

S9KEAZN16AMLC specifications
Parameter / AttributeSpecification / Value
SeriesKinetis KEA
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.7V ~ 5.5V
Operating temperature-40°C ~ 125°C (TA)
Speed40MHz
PackageTray
RAM size2K x 8
Core size32-Bit Single-Core
EEPROM size256 x 8
PeripheralsLVD, POR, PWM, WDT
ConnectivityI²C, LINbus, SPI, UART/USART
Number of i (O)28
Core processorARM® Cortex®-M0+
Case32-LQFP
Data convertersA/D 16x12b
Program memory size16KB (16K x 8)

Technical details

ARM Cortex-M0+ at 40 MHz with automotive temperature range

The S9KEAZN16AMLC: This core architecture delivers deterministic interrupt response and a 2-stage pipeline that executes most instructions in a single cycle, making it suited for real-time control loops in automotive body electronics — window lifts, seat adjusters, and HVAC damper actuators.

Memory partition and peripheral budget

The 16 KB Flash holds the application code and constant data; the 2 KB RAM handles stack and runtime variables. The 256-byte EEPROM stores calibration parameters or fault codes that must survive power cycles — no external serial EEPROM needed for small-footprint designs. The 16-channel 12-bit ADC is the primary analog interface, sufficient for monitoring multiple sensor inputs — temperature, pressure, position — in a single control loop. Connectivity includes I²C, LINbus, SPI, and UART/USART, covering the common automotive and industrial bus standards without external transceivers for LIN. Built-in peripherals — low-voltage detect (LVD), power-on reset (POR), PWM, and watchdog timer (WDT) — reduce external component count for safety-monitored applications.

Package, footprint, and compliance

The 0.80 mm pitch allows routing on a two-layer board for most designs, though a four-layer stack-up improves signal integrity for the ADC reference and reduces EMI from the 40 MHz clock.

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