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NXP Semiconductors MCIMX6L2DVN10AB — Microcontrollers & Processors (MCU / MPU / DSP)

MCIMX6L2DVN10AB NXP i.MX6SL ARM Cortex-A9 1.0GHz MPU

MPNMCIMX6L2DVN10AB
End of Life

NXP Semiconductors i.MX6SL series applications processor, MCIMX6L2DVN10AB, ARM Cortex-A9 single core, 1.0GHz, 432-MAPBGA (13x13 mm), tray.

$28.08Ref. price · indicative, final on quote
Packaging432-TFBGA
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
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Specifications

MCIMX6L2DVN10AB Technical Specifications
ParameterValue
Seriesi.MX6SL
Mounting typeSurface Mount
Voltage - i (O)1.2V, 1.8V, 3.0V
Additional interfacesAC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART
Display & interface controllersKeypad, LCD
Operating temperature0°C ~ 95°C (TJ)
Number of cores (Bus width)1 Core, 32-Bit
USBUSB 2.0 + PHY (3)
Speed1.0GHz
PackageTray
Ethernet10/100Mbps (1)
Core processorARM® Cortex®-A9
Case432-TFBGA
RAM controllersLPDDR2, LVDDR3, DDR3
Co-Processors (DSP)Multimedia; NEON™ SIMD
Security featuresARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Graphics accelerationYes

Product details

Core and speed — what 1.0 GHz buys you

The MCIMX6L2DVN10AB: This is a single-core ARM Cortex-A9 running at 1.0 GHz, a 32-bit application processor aimed at human-machine interfaces, point-of-sale terminals, and connected display systems where the balance of performance to power matters more than raw throughput. The NEON SIMD coprocessor handles multimedia vector operations in hardware — think pixel processing, audio filtering, or basic image transforms — without loading the core. Graphics acceleration is on-die, so the LCD controller can drive a display without an external GPU for typical 2D UI workloads.

Memory interface — which DRAM types it talks to

The memory controller supports LPDDR2, LVDDR3, and DDR3 — three DRAM families covering low-power portable designs through standard DDR3 modules. This flexibility means the same MPU can serve a battery-powered tablet (LPDDR2) and a mains-powered kiosk (DDR3) with only a memory-device change, not a processor spin.

Package and board-fit — 432-MAPBGA

Housed in a 432-ball MAPBGA, 13x13 mm body — the 0.50 mm ball pitch is standard for this density and routes cleanly on a 4-layer board with microvias. The supplier device package is 432-MAPBGA (13x13), surface-mount only. No socketed or through-hole variant exists for this part.

Temperature grade — 0°C to 95°C junction

Rated for 0°C to 95°C junction temperature — this is a commercial/industrial grade, not automotive. It fits indoor equipment, kiosks, and climate-controlled enclosures, but not under-hood or outdoor direct-sun deployments.

Peripheral set — USB, Ethernet, and serial interfaces

Three USB 2.0 ports with integrated PHY — each port is a complete physical-layer interface, so no external transceiver is needed for host or OTG operation. One 10/100 Mbps Ethernet MAC with dedicated MII/RMII interface — the PHY is external, but the MAC handles the protocol stack in hardware. Additional serial interfaces include AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, and UART — covering audio codecs, touch controllers, wireless modules, and storage.

Security features — hardware root of trust

The security subsystem includes ARM TrustZone, boot security, cryptography acceleration, a secure fuse box, secure JTAG, secure memory, secure RTC, and tamper detection — enough to run a secure boot chain and encrypt data at rest without a separate secure element.

Frequently asked questions

What compliance documentation does NXP provide for MCIMX6L2DVN10AB?

The part is ROHS3 Compliant per the manufacturer's declaration. NXP provides a standard RoHS certificate of compliance and material declaration upon request. No UL or IEC certification is listed in the product record.