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NXP Semiconductors MC56F82743VFM — Microcontrollers & Processors (MCU / MPU / DSP)

NXP MC56F82743VFM 32-bit MCU, 100MHz, 64KB Flash, 32-HVQFN

MPNMC56F82743VFM
End of Life

NXP Semiconductors 56F8xxx series 32-bit MCU, MC56F82743VFM, 56800EX core, 100MHz, 64KB FLASH, 4K x 16 RAM, 32-HVQFN (5x5) package, tray.

$10.05Ref. price · indicative, final on quote
Packaging32-VFQFN Exposed Pad
StockIn Stock (18)
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
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Specifications

MC56F82743VFM Technical Specifications
ParameterValue
Series56F8xxx
Mounting typeSurface Mount, Wettable Flank
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.7V ~ 3.6V
Operating temperature-40°C ~ 105°C (TA)
Speed100MHz
PackageTray
RAM size4K x 16
Core size32-Bit Single-Core
PeripheralsDMA, POR, PWM, WDT
ConnectivityI2C, SCI, SPI
Number of i (O)26
Core processor56800EX
Case32-VFQFN Exposed Pad
Data convertersA/D 6x12b; D/A 2x12b
Program memory size64KB (32K x 16)

Product details

100 MHz 56800EX core with on-chip signal-chain integration

The MC56F82743VFM is a 32-bit single-core MCU built around the 56800EX core, clocked at 100 MHz — this sets the ceiling for real-time loop rates in motor-control or digital-power applications where the control law must converge within a PWM cycle. 64 KB of on-chip flash (32K x 16) and 4K x 16 of RAM provide enough headroom for a field-oriented-control firmware stack plus a modest data buffer, though the RAM is tight for large look-up tables or multi-axis interpolation. The integrated data converters — six 12-bit ADC channels and two 12-bit DAC channels — let the part sample phase currents and output analog references without external converters, reducing BOM count and board area.

Package, supply, and peripheral fit

Housed in a 32-VFQFN exposed-pad package (supplier device package 32-HVQFN, 5x5 mm) with wettable-flank termination — the exposed pad improves thermal conduction to the PCB, and the wettable flank enables automated optical inspection (AOI) after reflow. Peripheral set includes DMA, POR, PWM, and WDT, plus I2C, SCI, and SPI serial interfaces — the PWM module is the primary interface for driving power-stage gate drivers in motor or SMPS designs. 26 general-purpose I/O lines are available; the pin count in the 32-HVQFN package limits the number of simultaneously usable peripherals, so the I/O multiplexing plan should be confirmed against the application's signal list.

Lifecycle and compliance status

ROHS3 compliant, meeting the current restriction-of-hazardous-substances directive.