BAP64LX,315

NXP Semiconductors

NXP BAP64LX,315 single PIN diode, 60V peak reverse voltage, 100 mA max current, 1.5 Ohm resistance at 100mA/100MHz, 0.3pF capacitance at 20V/1MHz, 150 mW dissipation, SOD-882 package, -65°C to 150°C junction temperature.

NXP Semiconductors BAP64LX,315
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

BAP64LX,315 specifications
Parameter / AttributeSpecification / Value
Diode typePIN - Single
Voltage - peak reverse60V
Current - max100 mA
Power dissipation150 mW
Operating temperature-65°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
CaseSOD-882
Resistance @ if,1.5Ohm @ 100mA, 100MHz
Capacitance @ vr,0.3pF @ 20V, 1MHz

Technical details

RF switch and attenuator element in SOD-882

The NXP BAP64LX,315 is a single PIN diode designed for RF switching and attenuator applications up to several GHz. Its 0.3 pF capacitance at 20 V reverse bias provides good off-state isolation, while the 1.5 Ohm series resistance at 100 mA forward current keeps insertion loss low in the on-state.

Parametric fit for RF front-end designs

The 60 V peak reverse voltage rating allows the BAP64LX,315 to handle moderate RF power levels without self-biasing — useful in antenna switch matrices or T/R switches where the RF voltage swing can exceed 30 V peak. Maximum forward current of 100 mA and power dissipation of 150 mW define the DC bias limit. In a typical shunt-switch configuration at 100 MHz, 10 mA bias gives roughly 15 Ohm on-resistance; the 1.5 Ohm floor at 100 mA is the low-loss ceiling for high-linearity paths.

The SOD-882 package (SOD2 footprint) keeps parasitic inductance low — critical for maintaining the 0.3 pF capacitance spec at UHF frequencies.

BAP64LX,315
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