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NXP USA Inc. LPC5528JBD64K — Microcontrollers & Processors (MCU / MPU / DSP)

NXP LPC5528JBD64K MCU, 150MHz Cortex-M33, 512KB Flash, 64-HTQFP

MPNLPC5528JBD64K
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NXP LPC5528JBD64K, LPC552x series, 32-bit ARM Cortex-M33 single-core at 150MHz, 512KB FLASH / 256KB RAM, 64-HTQFP exposed pad (10x10mm), 1.8–3.6 V supply, -40 to 105°C, 36 I/O, 10-channel 16-bit ADC, Flexcomm / I²C / SPI / UART / USB, tray.

$8.8500Ref. price · indicative, final on quote
Packaging64-TQFP Exposed Pad
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

LPC5528JBD64K Technical Specifications
ParameterValue
SeriesLPC552x
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~105°C(TA)
Speed150MHz
PackageTray
RAM size256K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
ConnectivityFlexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Number of i (O)36
Core processorARM® Cortex®-M33
Case64-TQFP Exposed Pad
Data convertersA/D 10x16b
Program memory size512KB (512K x 8)

Frequently asked questions

Is there a second source or compatible variant in the NXP LPC55xx family?

The broader NXP LPC5500 series shares the 64-HTQFP footprint and Cortex-M33 core architecture. Specific pin-mapping and feature-set differences between variants (551x, 512x, 552x) require confirmation against the datasheet pinout table before committing a second-source position on a locked layout.

Can the LPC5528JBD64K drop into an existing 64-HTQFP layout from a 551x design?

The 64-HTQFP exposed pad package (10x10mm) and 36 I/O count are consistent with the 551x footprint, but the exposed pad thermal via field under the ePad must be verified against your board layout — the thermal impedance of the ePad solder joint at sustained 105°C TA is a board-level detail, not a device spec.

What is the lead time for a tray-pack run of 25 units?

Tray packaging is confirmed for this MPN. Specific lead times for a 25-unit MRO replenishment run are quote-to-order — submit an RFQ with your target quantity and required date.