NXP LPC55S26JBD64K — 150MHz Cortex-M33 MCU, 256KB Flash, 64-HTQFP
NXP LPC55S2x series, ARM Cortex-M33 single-core MCU, 150MHz, 256KB Flash, 144KB SRAM, 1.8–3.6V supply, -40°C to 105°C operating temperature, 64-HTQFP exposed pad in tray packaging.
- 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
- Date & lot codes on quoteStated per line before you commit; label photos on request.
- MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
- PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.
Specifications
| Parameter | Value |
|---|---|
| Series | LPC55S2x |
| Mounting type | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.8V ~ 3.6V |
| Operating temperature | -40°C ~ 105°C (TA) |
| Speed | 150MHz |
| Package | Tray |
| RAM size | 144K x 8 |
| Core size | 32-Bit Single-Core |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT |
| Connectivity | Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB |
| Number of i (O) | 36 |
| Core processor | ARM® Cortex®-M33 |
| Case | 64-TQFP Exposed Pad |
| Data converters | A/D 10x16b |
| Program memory size | 256KB (256K x 8) |
Frequently asked questions
Is the LPC55S26JBD64K the secure (S) variant of the standard LPC5526 — can I cross-reference between them?
The LPC55S26 is the secure boot variant of the standard LPC55 series. The 'S' designation indicates on-chip security features not present in the non-secure counterpart. Drop-in replacement across the secure/non-secure boundary is firmware-dependent — a design targeting the standard LPC5526 cannot be populated with the LPC55S26 without confirming TrustZone region allocation and secure boot key provisioning. Check the NXP LPC55S2x datasheet for flash region partitioning before assuming firmware compatibility.
What is the lead time and PCN watch for a 25-unit panel build on tray-packaged LPC55S26JBD64K?
Lead time and firm pricing are quoted-to-order through distribution — raise an RFQ with your required quantity and delivery window. For a panel build of 25 units, confirm the distributor can fulfill in full tray packs; check whether a tape-and-reel variant of the same die is available to match your production line format. PCN activity on the NXP LPC55S2x series should be monitored via the NXP PCN portal for the LPC55S26 base part number.