NXP USA Inc.
NXP Kinetis KL1 series, MKL17Z256VFT4, ARM Cortex-M0+ 48 MHz, 256 KB Flash, 32 KB RAM, 1.71 V–3.6 V supply, -40°C to 105°C operating temperature, 40 I/O, 18-ch 16-bit ADC plus 12-bit DAC, LINbus/I²C/SPI/USART, 48-QFN (7×7 mm) exposed pad, Tray.
MOQ 1 · Tray · RoHS · EIA-481 · DAP/DDP · T/T
| Parameter / Attribute | Specification / Value |
|---|---|
| Series | Kinetis KL1 |
| Mounting | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.71V ~ 3.6V |
| Operating temperature | -40°C~105°C(TA) |
| Speed | 48MHz |
| Package | Tray |
| RAM size | 32K x 8 |
| Core size | 32-Bit Single-Core |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT |
| Connectivity | I²C, LINbus, SPI, UART/USART |
| Number of i (O) | 40 |
| Core processor | ARM® Cortex®-M0+ |
| Case | 48-UFQFN Exposed Pad |
| Data converters | A/D 18x16b; D/A 1x12b |
| Program memory size | 256KB (256K x 8) |
The 18-channel 16-bit ADC and one 12-bit DAC are on-chip, so a single-board design can digitise multiple analog inputs without an external multiplexer or a separate DAC.
The 48-QFN (7×7 mm) exposed pad package gives 40 I/O lines in a compact footprint. Surface-mount assembly is standard; no special reflow profile beyond the lead-free solder joint requirements.
Listed as Active.
