MKL02Z32CAF4R

NXP USA Inc. · Kinetis KL02 Series

NXP Kinetis KL02, MKL02Z32CAF4R, 32-bit ARM Cortex-M0+ MCU, 48MHz, 32KB Flash, 4KB RAM, 18 I/O, 1.71–3.6V supply, -40°C to 85°C, 20-WLCSP (1.99×1.94 mm) on tape-and-reel.

NXP USA Inc. MKL02Z32CAF4R
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[IN STOCK] In Stock: 15 pcs
$4.47/ pc

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MOQ 1 · Tape & Reel (TR) Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

MKL02Z32CAF4R specifications
Parameter / AttributeSpecification / Value
SeriesKinetis KL02
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.71V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed48MHz
PackageTape & Reel (TR) Cut Tape (CT)
RAM size4K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, LVD, POR, PWM, WDT
ConnectivityI2C, SPI, UART/USART
Number of i (O)18
Core processorARM® Cortex®-M0+
Case20-UFBGA, WLCSP
Data convertersA/D 10x12b
Program memory size32KB (32K x 8)

Technical details

It runs at 48 MHz, carries 32 KB of Flash and 4 KB of RAM, and brings 18 general-purpose I/O plus a 10-channel 12-bit ADC. The part lives in a 20-ball WLCSP (1.99×1.94 mm) — that footprint is the whole story: you pick this MCU when board real estate is the tightest constraint and a few millimetres decide the layout.

Connectivity covers I2C, SPI, and UART/USART, enough for a local sensor bus or a serial link to a host controller.

Package reality — WLCSP handling

The 20-WLCSP (1.99×1.94 mm) is a wafer-level chip-scale package with no mould compound. PCB pads must match the ball layout exactly; rework is not trivial.

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