The peripheral list includes brown-out detect, POR, DMA, PWM, WDT, and a 10-channel 16-bit ADC. Connectivity covers Flexcomm, I²C, SPI, UART/USART, USB, and MMC/SD/SDIO. The Flexcomm interface can be reconfigured as an additional serial port or I²C, which helps when the board layout needs to swap pin functions without a PCB spin.
LPC55S26JBD100K
NXP USA Inc.
NXP LPC55S2x series, LPC55S26JBD100K, 32-bit ARM Cortex-M33 single-core MCU, 150 MHz, 256 KB Flash, 144 KB RAM, 1.8 V – 3.6 V supply, -40°C to 105°C, 100-LQFP exposed pad (14×14 mm), 64 I/O, USB/I2C/SPI/UART, tray.
[IN STOCK] In Stock: 5 pcs
MOQ 1 · Tray · RoHS · EIA-481 · DAP/DDP · T/T
Technical specifications
| Parameter / Attribute | Specification / Value |
|---|---|
| Series | LPC55S2x |
| Mounting | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.8V ~ 3.6V |
| Operating temperature | -40°C~105°C(TA) |
| Speed | 150MHz |
| Package | Tray |
| RAM size | 144K x 8 |
| Core size | 32-Bit Single-Core |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT |
| Connectivity | Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB |
| Number of i (O) | 64 |
| Core processor | ARM® Cortex®-M33 |
| Case | 100-LQFP Exposed Pad |
| Data converters | A/D 10x16b |
| Program memory size | 256KB (256K x 8) |
Technical details
LPC55S26JBD100K
[ALLOC] verified