LPC55S16JEV98E

NXP USA Inc. · LPC55S1x Series

NXP LPC55S1x series, ARM Cortex-M33 150MHz single-core MCU, 256KB FLASH, 96KB SRAM, 64 I/O, 10-channel 16-bit SAR ADC, CANbus/Flexcomm/I2C/SPI/UART/USB, 1.8–3.6V supply, -40°C to 105°C, 98-VFBGA (7x7mm) surface-mount tray.

NXP USA Inc. LPC55S16JEV98E
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Technical specifications

LPC55S16JEV98E specifications
Parameter / AttributeSpecification / Value
SeriesLPC55S1x
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C ~ 105°C (TA)
Speed150MHz
PackageTray
RAM size96K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
ConnectivityCANbus, Flexcomm, I²C, SPI, UART/USART, USB
Number of i (O)64
Core processorARM® Cortex®-M33
Case98-VFBGA
Data convertersA/D 10x16b SAR
Program memory size256KB (256K x 8)

Technical details

The NXP LPC55S16JEV98E is a 32-bit ARM Cortex-M33 microcontroller running at 150 MHz, with 256 KB Flash and 96 KB SRAM. It belongs to the LPC55S1x series and targets industrial control, IoT edge nodes, and embedded systems that need a balance of compute throughput, peripheral integration, and extended temperature range.

150 MHz Cortex-M33 — what the speed buys you

The 150 MHz ARM Cortex-M33 core includes a single-cycle multiply-accumulate and a hardware divider, which helps with real-time control loops and sensor fusion. At this clock rate, the part can handle moderate DSP workloads without a dedicated coprocessor, though the 96 KB SRAM will limit large buffer or FFT operations.

Memory and peripheral set for BOM fit

The 96 KB SRAM supports multiple communication buffers and a modest heap. On the peripheral side, you get CANbus, Flexcomm (configurable serial interface), I2C, SPI, UART/USART, and USB — covering most industrial and IoT connectivity needs. The 10-channel 16-bit SAR ADC handles analog inputs like thermocouples or current shunts without an external converter.

The 98-VFBGA (7x7 mm) package keeps board area tight but requires careful PCB layout for BGA soldering and X-ray inspection.

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