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NXP USA Inc. LPC5516JEV98E — Microcontrollers & Processors (MCU / MPU / DSP)

NXP LPC5516JEV98E ARM Cortex-M33 MCU, 150MHz, 256KB Flash

MPNLPC5516JEV98E
Active

NXP LPC551x series, ARM Cortex-M33 single-core at 150MHz, 256KB FLASH, 96KB SRAM, 64 I/O, CANbus/USB/SPI/UART, operating -40°C to 105°C TA, 98-VFBGA (7×7mm) tray.

$8.9900Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LPC5516JEV98E specifications
ParameterValue
SeriesLPC551x
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~105°C(TA)
Speed150MHz
PackageTray
RAM size96K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
ConnectivityCANbus, Flexcomm, I²C, SPI, UART/USART, USB
Number of i (O)64
Core processorARM® Cortex®-M33
Case98-VFBGA
Data convertersA/D 10x16b SAR
Program memory size256KB (256K x 8)

Product details

The LPC5516JEV98E runs a single ARM Cortex-M33 core at 150 MHz, backed by 256 KB of Flash and 96 KB of SRAM. That clock rate, combined with the single-cycle multiply and hardware divide, keeps interrupt latency tight for motor-control loops or CANopen stacks.

Industrial temperature range and package reality

NXP lists the LPC5516JEV98E as Active. No last-time-buy window, no end-of-life notice.

Frequently asked questions

What is the closest pin-compatible alternative to LPC5516JEV98E?

Within the LPC551x series, the LPC5516JEV98E shares the same 98-VFBGA footprint and pinout with other LPC5516 variants that differ only by Flash and SRAM density. For a direct cross, check the LPC5516JBD100 or LPC5516JEV98 — both are same-family parts with identical core and package.

What is LPC5516JEV98E's listed speed?

The core processor runs at 150 MHz.

What compliance documentation does NXP provide for LPC5516JEV98E?

NXP supplies RoHS and REACH compliance declarations for this part. The 98-VFBGA package is lead-free and compatible with lead-free soldering processes. Specific UL or IEC certifications are not listed in the standard documentation; contact NXP directly for certification letters if required by your end-equipment standard.