LPC54608J512ET180E

NXP USA Inc.

NXP LPC546xx series ARM Cortex-M4 MCU, 180 MHz, 512 KB Flash, 200 KB RAM, 145 I/O, Ethernet/USB/CAN, 1.71-3.6 V, -40 to 105 °C, 180-TFBGA tray.

NXP USA Inc. LPC54608J512ET180E
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[IN STOCK] In Stock: 15 pcs
$15.25/ pc

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Technical specifications

LPC54608J512ET180E specifications
Parameter / AttributeSpecification / Value
SeriesLPC546xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.71V ~ 3.6V
Operating temperature-40°C~105°C(TA)
Speed180MHz
PackageTray
RAM size200K x 8
Core size32-Bit Single-Core
EEPROM size16K x 8
PeripheralsBrown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
ConnectivityCANbus, Ethernet, I²C, SPI, UART/USART, USB
Number of i (O)145
Core processorARM® Cortex®-M4
Case180-TFBGA
Data convertersA/D 12x12b
Program memory size512KB (512K x 8)

Technical details

Memory and peripheral fit for the BOM

The LPC54608J512ET180E: 512 KB Flash and 200 KB RAM give room for a real-time OS, TCP/IP stack, and a moderate GUI frame buffer. The 16 KB EEPROM emulation block holds calibration constants without an external serial EEPROM. With 145 GPIOs and a 12x12 mm BGA, the part packs a lot of I/O into a board area that still routes on a 4-layer PCB with proper via fan-out.

Package and assembly consideration

The 180-TFBGA (12x12 mm) uses a fine-pitch ball array. It requires a solder-paste stencil, reflow profile, and X-ray inspection — not a hand-solderable package.

LPC54608J512ET180E
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