NXP USA Inc.
NXP LPC2200 series ARM7 MCU, LPC2292FBD144/01,5, 60 MHz, 256 KB Flash, 16 KB RAM, 112 I/O, CAN/UART/SPI/I2C, 144-LQFP, -40°C to 85°C.
MOQ 1 · Tray · RoHS · EIA-481 · DAP/DDP · T/T
| Parameter / Attribute | Specification / Value |
|---|---|
| Series | LPC2200 |
| Mounting | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.65V ~ 3.6V |
| Operating temperature | -40°C~85°C(TA) |
| Speed | 60MHz |
| Package | Tray |
| RAM size | 16K x 8 |
| Core size | 16/32-Bit |
| Peripherals | POR, PWM, WDT |
| Connectivity | CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART |
| Number of i (O) | 112 |
| Core processor | ARM7® |
| Case | 144-LQFP |
| Data converters | A/D 8x10b |
| Program memory size | 256KB (256K x 8) |
The 60 MHz core speed is in the mid-range of the ARM7 portfolio. It can service a CAN message every few microseconds.
256 KB Flash organized as 256K x 8, with on-chip bootloader support for in-system programming via UART. 16 KB SRAM (16K x 8).
