NXP LPC2100 series ARM7-based 16/32-bit MCU, LPC2119FBD64/01EL, 60 MHz core, 128 KB Flash, 16 KB RAM, CAN 2.0B, I²C, SPI, SSP, UART, 4×10-bit SAR ADC, 46 GPIO, 1.65–3.6 V supply, -40 to 85°C, 64-LQFP (10×10 mm) tray.
| Parameter | Value |
|---|---|
| Series | LPC2100 |
| Mounting | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.65V ~ 3.6V |
| Operating temperature | -40°C~85°C(TA) |
| Speed | 60MHz |
| Package | Tray |
| RAM size | 16K x 8 |
| Core size | 16/32-Bit |
| Peripherals | POR, PWM, WDT |
| Connectivity | CANbus, I²C, Microwire, SPI, SSI, SSP, UART/USART |
| Number of i (O) | 46 |
| Core processor | ARM7® |
| Case | 64-LQFP |
| Data converters | A/D 4x10b SAR |
| Program memory size | 128KB (128K x 8) |
The NXP LPC2119FBD64/01EL is a 16/32-bit ARM7 microcontroller from the LPC2100 series, with a 60 MHz core, 128 KB Flash, and 16 KB SRAM.
Housed in a 64-lead LQFP (10×10 mm body), the MCU is a surface-mount part for reflow soldering. The 46 GPIOs are distributed across the four sides.
The LPC2119FBD64/01EL is sourced and quoted to order through independent distribution. Availability and current pricing are confirmed at quote time — submit an RFQ for a firm price and lead time.
The LPC2119FBD64/01EL is rated for -40°C to 85°C, which qualifies it for industrial and automotive under-hood environments.
The /01EL suffix indicates a tray-pack variant with ROHS3 compliance. The /00 variant may have an earlier lead-free or tin-lead finish; verify the specific ordering code against your assembly house's solder requirements.
The LPC2129 is pin-compatible in the same 64-LQFP footprint and shares the same ARM7 core, but it offers 64 KB SRAM versus the 16 KB on the LPC2119. The extra RAM is the deciding factor for buffer-heavy applications.