Industrial temperature grade and package fit
The 32-HVQFN (7x7 mm) exposed-pad package keeps board area small. Supply range is 1.8 V to 3.6 V.
LPC1114FHN33/302K
NXP USA Inc. · LPC1100L Series
NXP LPC1100L series LPC1114FHN33/302K, ARM Cortex-M0 32-bit MCU, 50MHz, 32KB Flash, 4KB SRAM, 28 I/O, 8x10b SAR ADC, I²C/SPI/UART, 1.8V-3.6V, -40°C to 85°C, 32-HVQFN (7x7mm) exposed pad, tray.
[IN STOCK] In Stock: 5 pcs
MOQ 1 · Tray · RoHS · EIA-481 · DAP/DDP · T/T
Technical specifications
| Parameter / Attribute | Specification / Value |
|---|---|
| Series | LPC1100L |
| Mounting | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.8V ~ 3.6V |
| Operating temperature | -40°C~85°C(TA) |
| Speed | 50MHz |
| Package | Tray |
| RAM size | 4K x 8 |
| Core size | 32-Bit Single-Core |
| Peripherals | Brown-out Detect/Reset, POR, WDT |
| Connectivity | I²C, SPI, UART/USART |
| Number of i (O) | 28 |
| Core processor | ARM® Cortex®-M0 |
| Case | 32-VQFN Exposed Pad |
| Data converters | A/D 8x10b SAR |
| Program memory size | 32KB (32K x 8) |
Technical details
LPC1114FHN33/302K
[ALLOC] verified