LPC1111FHN33/102K

NXP USA Inc.

NXP LPC1100L series, 32-bit ARM Cortex-M0 MCU, 50MHz, 8KB Flash, 2KB RAM, 28 GPIOs, I²C/SPI/UART, 8x10b SAR ADC, 1.8V–3.6V supply, -40°C to 85°C, 32-VQFN exposed-pad package.

NXP USA Inc. LPC1111FHN33/102K
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[IN STOCK] In Stock: 31 pcs
$3.68/ pc

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Technical specifications

LPC1111FHN33/102K specifications
Parameter / AttributeSpecification / Value
SeriesLPC1100L
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed50MHz
PackageTray
RAM size2K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, POR, WDT
ConnectivityI²C, SPI, UART/USART
Number of i (O)28
Core processorARM® Cortex®-M0
Case32-VQFN Exposed Pad
Data convertersA/D 8x10b SAR
Program memory size8KB (8K x 8)

Technical details

50 MHz Cortex-M0 — what it means for the control loop

The LPC1111FHN33/102K runs the ARM Cortex-M0 core at 50 MHz, supporting I²C, SPI, and UART peripherals. The 8 KB Flash and 2 KB RAM are modest; firmware must fit within that footprint.

Industrial temperature range and package

Rated -40°C to 85°C, this MCU suits factory-floor controllers, outdoor telecom nodes, and HVAC panels — not under-hood or extended-temp applications. The 32-VQFN exposed-pad package (7x7 mm HVQFN land pattern) needs a thermal via array under the pad for adequate heat transfer. The exposed pad also ties to the ground plane; verify the PCB footprint matches the supplier device package outline before layout.

Active production — no LTB concern

The LPC1111FHN33/102K carries an Active lifecycle status. NXP continues to manufacture the LPC1100L series, so new BOMs can be specified without near-term obsolescence risk. Sourced and quoted to order against an RFQ through independent distribution; availability and current pricing confirmed at quote time.

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